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EDA Takes on TCAD
 The electronic design automation (EDA) community is shifting its focus to TCAD (Technology Computer-Aided Design) for sub-20 nm processes and novel devices. While attention in previous years had been placed on basic layer and element creation, the current focus is on understanding how sub-20 nm processes and new device technologies such as 3D transistors, FinFets, graphene devices, and double- and quad-patterned memories should be modeled so that the results are compatible with current device design methods.
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Approach Reduces Overall Simulation Time
 The authors of this piece in Design & Reuse bring to light a new method for scaling down simulation time and provide functional coverage analysis for intellectual property (IP) cores. More specifically, the article explains how overall simulation time can be scaled down by integrating scripts with existing functional coverage tools and reviews how to implement functional coverage for complex IP Cores.
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Enter the Era of the NoC
 System-on-chip (SoC) implementations will no longer be able to rely on traditional shared-bus architectures due to the increasing need for more bandwidth and shrinking feature sizes. In order to address the issues with on-chip buses, Network-on-Chip (NoC) communication architectures are emerging as a potential alternative that would utilize a packet-based micro-network for inter-IP communication.
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Bright Outlook for FPGAs in 2012
 FPGAs have fared well throughout the economic downturn and their market dominance can be attributed to their successful displacement of microcontrollers, microprocessors, DSP processors, and specialized co-processors. Although FPGAs aren't always suitable for every situation, technology advancements in 2011 made them the ideal alternative to application-specific standard products (ASSPs).
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Cleanroom Static EliminatorsNRD, LLC
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Analog Devices' AD57xx DACs, Now Available at Digi-KeyDigi-Key Corporation
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 NRD, LLC is the only manufacturer of static eliminators to offer our proprietary Alpha Energy Ionizers. Only Alpha Energy Ionizers can offer you particulate free, zero-volts balanced performance for your most demanding static eliminating applications. We offer static eliminating blowers, bars, spot sources, and blow-off guns.
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 Offered in quad, voltage, and current outputs operating with a power supply range from -26.4 to +33 V, Analog Devices' AD57xx family of DACs offer dynamic, on-chip power control to minimize package power dissipation in current mode by regulating the voltage on the output driver using a DC-to-DC boost converter.
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FFDMs Promote Wireless Power Charging
 To address the issues plaguing current electromagnetic inductive coupling wireless-power (EMIC-WP) systems, designers are looking to integrate flux-field directional materials (FFDMs) into them. Use of FFDMs will help alleviate the problems associated with EMIC-WP power-transfer efficiency, dimensions, and safety, and ultimately make mobile-device charging a more viable option for consumers.
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Getting the Most Out of Boost Regulators
 When designing high voltage boost converters, engineers often rely on an expensive technique involving use of a controller with a high voltage boost regulator or an external field-effect transistor (FET). However, a more affordable alternative uses a boost regulator beyond its rated voltage by employing an external FET in a common-gate cascode configuration.
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High-density/3D Interconnects Seek New Underfilling Processes
 The move to high-density interconnect packaging with 3D chips and copper pillar bumping technology is forcing new requirements on underfill. A recent i-Micronews article takes a closer look at the advantages of underfilling, the changes in this technology necessary for next-generation devices, and the key post-applied and pre-applied underfill processes that have evolved over time.
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Will Carbon Nanotubes Connect 3D Chips?
 Carbon nanotubes (CNTs) may offer a viable way for interconnecting 3D electronics. University researchers formed vertical CNT vias through two stacked chips in order to connect them. 3D devices using such CNT vias will be capable of improved performance and speedier signal transfer, but will also reduce production costs when compared to the current copper interconnect technology.
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SMM 3812 Size SMD FusesBel Fuse Inc.
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Compact High Load, Precise, Rigid Ball Screw ActuatorNB Corporation of America
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 Bel's new SMM fuses provide high amp ratings up to 30 A in a compact, 3812 size, surface mount package. These products can be used for any high current devices or power supplies requiring 20 to 30 A fuses at up to 250 VAC or 65 VDC.
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 Precision ball screw and slide guide combo eliminates complex adjustments. Single, U-shaped high carbon steel rail and base can be one-end supported. Four ball circuits for more load and accuracy. Circuits positioned closer to base for more rigidity.
More points-of-contact to guide block and rail for optimum stability. Visit us here for more... |
Careers & Commentary . . .
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What It Takes to Be an Effective Engineering Team Leader
 Having a good team leader is always crucial in ensuring that the engineering project unfolds according to the desired plan. Leading an engineering team can be challenging, especially when a staff-level engineer is elevated to the supervisory or managerial level. It is therefore essential to select someone who has the appropriate skill set and core competencies required to do the job.
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High-strength Magnets Deliver Deadly Force
 Did you know that today's compact high-strength magnets could crush people's fingers? A slow-motion tomato-smashing video demonstrates the power of two neodymium-iron-boron (NdFeB) magnets hugging each other with 530 lbs of force. Prying them apart requires a non-magnetic crowbar or heating them above 175 F to knock the electron spins out of alignment.
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Share Your Thoughts . . .
About This Month's Topic
 When Will a Cell Phone Run on Solar Power?Could a cellphone run entirely on sunlight? What are the biggest technical challenges impeding such developments?
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