The Emergence of Network Coprocessors, and more...

TVs are Getting Smarter Over the years, television sets have evolved to deliver flatter, bigger, better, and brighter screens. And lately, makers have also been touting 3D TVs. 2012, however, signals a new era for smart TVsaccording to this piece from The Guardian. This year's Consumer Electronics Show (CES 2012) features smart TV products that intelligently blend the virtues of Internet connectivity and high-definition TV. LG Electronics, for example, used the show to introduce Google TV, while Samsung demonstrated voice and motion-controlled television interfaces.   High Energy Resistor Solutions HVR Advanced Power Components, Inc. High Frequency Transformer Design Solutions Triad Magnetics HVR provides cost-effective, engineered solutions for high-stress resistor applications. We offer high-voltage solutions for power conversion, T&D, automotive, industrial, medical, research, and military applications. Our ceramic resistor products range from low-cost U-series, commonly used in power conversion equipment such as motor drives and UPS, to multi-megajoule custom assemblies. Learn more... Triad specializes in custom magnetics. We have experienced engineers ready to assist you. Our Design Center uses a concurrent design process which will speed you from spec, to prototype, to test, and finally to qualification. Triad's capabilities include designing to a wide range of safety agencies: UL/CSA/TUV/VDE/CE with insulations systems rated from 130 C-220 C. Thermal Interface Performance Up to 17 W/m-K! INSUL-FAB, Division of Concote Corporation Nonisolated POL Converters with Efficiency to 95% Bel Power Inc. If you're looking for the high performance, fast response, complimentary prototypes, and the great pricing for TIM's, look no further than INSUL-FAB Thermal Management Products. We offer gap filler, films, and putty options with conductivity from 1 to 17 W/m-K. For easy comparison, we can help cross-reference. Learn more about this. Thesenon-isolated DC/DC converters are the latest addition to Bel Power's portfolio of SIP converters capable of delivering 3 A to 120 A of output current. They are engineered for a broad array of PC board mounted power applications and usable in almost any space-constrained application with an available 12 V power source.
Test & Measurement Equipment . . .
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EDA . . . Learn More Test Challenges in the 3D Chip Era As chip designers migrate toward 3D die stacking for higher density at lower cost, IC test is turning out to be the biggest challenge. Consequently, new techniques are needed to test the silicon interposers with through-silicon-vias (TSVs), along with the 3D chip designs themselves. In fact, to address this issue, IEEE has formed a new 3D Test Working Group, which is hammering out a proposed standard called IEEE P1838. An article and video, courtesy of Chip Design investigates IEEE efforts to define the architecture and description language for the overall test flow within a 3D device. Blending EDA Tools and Test With a narrow window to successfully bring product to market for an early start, there is no question that design and test must go hand-in-hand. Rather than treating them as two separate areas, IC designers are combining EDA design tools with test and measurement instruments into a single flow. Manyvendors are driving this trend, according to this commentary from EDACafe. DSP, SoC, Programmable Logic . . . Learn More The Changing Face of SoCs System-on-a-chip or SoC design continues to evolve as new materials, new structures, and new models are introduced for designing and developing chips. Consequently, a number of changes are in the works. To give the designers a glimpse of what is coming down the road, System-Level Design editor Ed Sperling asked executives from across the SoC ecosystem what will change, what's driving those changes, and what the forthcoming SoC will look like in the next few years. Emerging Network Coprocessors In modern digital multimedia networks, DSP based media gateways are playing an important role in processing information, be it data, audio, or video. Today, network coprocessors are off-loading the processing burden of DSPs to handle disparate processing functions such as Ethernet switching, packet, and security acceleration. As a result, network coprocessors are altering the makeup of the gateway systems that funnel traffic across predominantly Ethernet/IP backbone networks. This white paper from Texas Instruments examines the evolution of media gateways and the emergence of the network coprocessors.   High Performance PCB and DC/DC Connector Anderson Power Products RF Shielded Enclosures Select Fabricators, Inc. APP PowerMod® PCB, rated to 30 amps, per UL 1977 and IEC512-3 test 5a. Up to 3 rows, 30 circuit connector. APP Saf-D-Grid® connects DC micro-grid powered by renewable energy or high efficiency DC sources. Meets international safety requirements for hazardous, low voltage applications including UL 950, and IEC 60950, 600 V. Out-of-the-box testing solutions from Select Fabricators, Inc. for 4G, 3G, LTE, Bluetooth, 802.11xx, and other wireless protocols. Lightweight, U.S. made RF Shielded Enclosures are easy to set up, making it possible to start testing in less than an hour with -90dB attenuation. Product range and specifications. CH Products Brand New VM Desktop APEM Components, Inc. Offshore and Domestic PCB Manufacturing at Any Volume  Bare Board Group, Inc. CH Products' brand new VM Desktop controller will be showcased at the upcoming ISC West show (Booth #8057) in Las Vegas, March 28-30, 2012. Featuring a three axis Hall effect joystick, 27 pushbutton switches, jog-shuttle dial, and USB interface, the VM Desktop is the most advanced professional quality USB-HID controller available. Printed Circuit Board Supplier — Bare Board Group(BBG) provides high-mix, low-to-high volume PCBs built in the Far East. With an expanded catalog of manufacturing capabilities, 3-5 week turn production orders, and multiple stocking options, BBG can support your PCB needs anywhere in the world. Power Sources & Conversion . . . Learn More New Model for the Smart Grid   The archaic utility grid has not changed much since the 1930s. But, the emergence of Smart Grid promises to change that structure radically. To revamp the electric grid and expedite the deployment of this paradigm shift, National Science Foundation Engineering Research Center's FREEDM Systems Center is developing a new model for the delivery of Smart Grid. How to Minimize Conducted and Radiated Emissions Switching DC-DC converters are a source of high-frequency noise. Designers, therefore, must ensure that converter-generated noise is filtered and contained. An article published on Digi-Key's Power Solutions site provides basic guidelines for minimizing EMI and CE (conducted emissions) in power conversion modules. Mechatronics . . . Learn More MEMS Module Integrates Three-axis Motion Sensing From gaming to advanced motion sensing in mobile devices, three-axis linear and angular motion sensors are being implemented in today's smartphones, tablets, and other such portable devices. While earlier designs depended on discrete single function sensors, a new inertial MEMS module integrates three-axis sensing of linear and angular motion in a single miniature 3.0 x 5.5 x 1.0 mm package. Big Market for MEMS Microphones   For benefits of size, temperature stability, and sound quality, MEMS microphones are rapidly being deployed in new generation tablets, smartphones, and headsets. Market watcher IHS iSuppli credits Apple for starting this trend in 2010 by adopting these microphones in iPhones and then extending their use to iPads. Now, Apple rivals like LG Electronics, Motorola, and Samsung Electronics are also exploiting the merits MEMS microphones, driving overall growth.   AutoBuzz — JTAG/boundary-scan Tool for debug  JTAG Technologies Inc. CSS Mixed Signal ASIC Solutions Custom Silicon Solutions, Inc. AutoBuzz is a software tool that uses a unique 'seek and discover' feature to scan completely a compliant design and then perform comparative tests using JTAG/boundary-scan. It only uses JTAG scan-chain information plus BSDL models of the JTAG/IEEE std 1149.1 compliant parts. Our team of analog and mixed-signal design experts is available to help tackle your specific design challenges. Whether it is a mixed-signal ASIC targeted for a commercial, military, industrial sensor, or medical device application, our specialists will work with you to ensure an efficient, cost-effectivedevelopment process.